05/01 Rev 1.5
Copyright
1999
∞
2
∞
!"#$ %&
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Device
Input Voltage Differential
(Output shorted to ground)
35V
35V
35V
Output Voltage
-5V
-12V
-15V
Input Voltage
-35V
-35V
-40V
150
°
C
-65
°
C to 150
°
C
300
°
C
Operating Junction Temperature
Hermetic (K, T, IG & L - Packages) ........................
Note 1. Values beyond which damage may occur.
Storage Temperature Range ..........................
Lead Temperature (Soldering, 10 Seconds) .................
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 35°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
IG Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 42°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The
θ
numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
FIGURE 1.
MAXIMUM AVERAGE POWER DISSIPATION
FIGURE 2.
QUIESCENT CURRENT VS. LOAD
FIGURE 3.
TEMPERATURE COEFFICIENT
Note 2. Range over which the device is functional.
CHARACTERISTIC CURVES
-55
°
C to 150
°
C
Operating Junction Temperature Range:
SG7900A/7900 .............................................
RECOMMENDED OPERATING CONDITIONS
(Note 2)