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參數(shù)資料
| 型號(hào)： | SHC5320KU |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | High-Speed, Bipolar, Monolithic SAMPLE/HOLD AMPLIFIER |
| 中文描述： | 高速，雙極，單片采樣/保持放大器 |
| 文件頁數(shù)： | 3/10頁 |
| 文件大小： | 87K |
| 代理商： | SHC5320KU |
3
SHC5320
Hermetic Ceramic
Top View
DIP
+
1
2
3
4
5
6
7
14
13
12
11
10
9
8
–Input
+Input
Offset Adjustment
Offset Adjustment
–V
CC
Reference
Common
Output
Mode Control
Supply Common
NC
External Hold
Capacitor
NC
+V
CC
Bandwidth Control
SHC5320KH, KP
SHC5320KU
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
–Input
+Input
Offset Adjustment
Offset Adjustment
NC
–V
CC
Reference
Common
Output
Mode Control
Supply Common
NC
NC
External Hold
Capacitor
NC
+V
CC
Bandwidth Control
+
PIN CONNECTIONS
Voltage Between +V
and –V
Terminals ......................................... 40V
Input Voltage........................................................... Actual Supply Voltage
Differential Input Voltage ...................................................................
±
24V
Digital Input Voltage .................................................................. +15V, –1V
Output Current, continuous
(2)
.........................................................
±
20mA
Internal Power Dissipation ............................................................. 450mW
Storage Temperature Range .................................... –65
°
C < T
< +150
°
C
Output Short-Circuit Duration
(3)
.........................................................None
Lead Temperature (soldering, 10s) ................................................. 300
°
C
CAUTION: These devices are sensitive to electrostatic discharge.
Appropriate I.C. handling procedures should be followed.
NOTES: (1) Absolute maximum ratings are limiting values, applied individually,
beyond which the serviceability of the circuit may be impaired. Functional
operation under any of these conditions is not necessarily implied. Absolute
maximum ratings apply to both dice and package parts, unless otherwise noted.
(2) Internal power dissipation may limit output current to less than +20mA. (3)
WARNING: This device cannot withstand even a momentary short circuit
to either supply.
ABSOLUTE MAXIMUM RATINGS
(1)
Top View
SO
SPECIFICATIONS (Cont.)
At +25
°
C, rated power supplies, gain = +1, and with internal holding capacitor, unless otherwise noted.
SHC5320KH, KP, KU
SHC5320SH
PARAMETERS
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
POWER SUPPLIES
+V
CC
–V
CC
+I
CC
(+V
CC
= 15V)
(9)
–I
CC
(–V
CC
= 15V)
(9)
+12
–12
+15
–15
11
–11
+18
–18
13
–13
6
6
6
6
6
6
6
6
6
6
V
V
mA
mA
TEMPERATURE
Specification
Storage
–40
–65
+85
+150
–55
6
+125
6
°
C
°
C
PACKAGE
Hermetic Ceramic, Plastic DIP, SO
6
Specification the same as SCH5320KH, KP, KU.
NOTES: (1) V
CM
=
±
5VDC. (2) Based on a
±
0.5V swing for each supply with all other supplies held constant. (3) V
O
= 10V step, R
L
= 2k
, C
L
= 50pF. (4) V
O
= 200mVp-p,
R
= 2k
, C
= 50pF. (5) V
IN
= 20Vp-p, R
= 2k
, C
= 50pF, unattenuated output. (6) V
= 20V step, R
= 2k
, C
= 50pF. (7) Simulated only, not tested. (8) V
=
0V, V
IH
= +3.5V, t
R
< 20ns (V
IL
to V
IH
). (9) Specified for zero differential input voltage between pins 1 and 2. Supply current will increase with differential input (as may
occur in the Hold mode) to approximately
±
28mA average at 20V differential.
PACKAGE
DRAWING
NUMBER
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
(1)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
SHC5320KH
SHC5320KP
SHC5320KU
"
SHC5320SH
CERDIP-14
DIP-14
SO-16
"
CERDIP-14
163
010
211
"
163
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
"
–55
°
C to +125
°
C
SHC5320KH
SHC5320KP
SHC5320KU
SHC5320KU
SHC5320SH
SHC5320KH
SHC5320KP
SHC5320KU
SHC5320KU/1K
SHC5320SH
Rail
Rail
Rail
Tape and Reel
Rail
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces
of “SHC5320KU/1K” will get a single 1000-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
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