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參數(shù)資料
| 型號： | SI2434-D-GT |
| 廠商： | Silicon Laboratories Inc |
| 文件頁數(shù)： | 54/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ISOMODEM GLOBAL DAA 24TSSOP |
| 標準包裝： | 62 |
| 系列： | * |
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Si2457/34/15/04
58
Rev. 1.3
15. 16-Pin SOIC Land Pattern
Figure 24 illustrates the recommended land pattern for the Si2457/34/15/04 16-Pin SOIC. Table 18 lists the values
for the dimensions shown in the illustration.
Figure 24. 16-Pin SOIC Land Pattern Diagram
Table 18. 16-Pin SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
C1
Pad Column Spacing
5.40
E
Pad Row Pitch
1.27
X1
Pad Width
0.60
Y1
Pad Length
1.55
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ASME Y14.5M-1994.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SI2434-D-GTR | 制造商:Silicon Laboratories Inc 功能描述:Modem Chip Chipset 24-Pin TSSOP T/R 制造商:Silicon Laboratories Inc 功能描述:33.6 KBPS ISOMODEM SYSTEM-SIDE - LEAD-FREE - Tape and Reel 制造商:Silicon Laboratories Inc 功能描述:IC ISOMODEM GLOBAL DAA 24TSSOP 制造商:Silicon Laboratories Inc 功能描述:33.6 kbps ISOmodem System-Side PBF |
| Si2434FS08-EVB | 功能描述:網(wǎng)絡開發(fā)工具 16-pin Si2434 + Si3008 ISOmodem Evaluation Board RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
| Si2434FS18-EVB | 功能描述:網(wǎng)絡開發(fā)工具 16-pin Si2434 + Si3018 ISOmodem Evaluation Board RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
| SI2434-FT | 功能描述:電信線路管理 IC CONTACT SILICON LABS FOR AVAILABILITY RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| SI2434-FT/REV B | 制造商:Silicon Laboratories Inc 功能描述:LEAD FREE ISO MODEM - Rail/Tube |
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