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參數(shù)資料
型號： SI3200-G-FSR
廠商： Silicon Laboratories Inc
文件頁數(shù)： 58/112頁
文件大?。?/td> 0K
描述： IC SLIC/CODEC 100V LINE 16SOIC
標準包裝： 2,500
系列： ProSLIC®
功能： 用戶線路接口概念（SLIC），CODEC
接口： GCI，PCM，SPI
電路數(shù)： 2
電源電壓： 3.3V，5V
電流 - 電源： 110µA
功率（瓦特）： 941mW
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-SOIC（0.154"，3.90mm Width）裸露焊盤
供應商設備封裝： 16-SOIC N
包裝： 帶卷 (TR)
包括： 電池切換，BORSCHT 功能，DTMF 生成和解碼，F(xiàn)SK 音調(diào)生成，調(diào)制解調(diào)器和傳真音調(diào)檢測
Si3220/25 Si3200/02
Rev. 1.3
5
Not
Recommended
fo
r N
ew
D
esi
gn
s
High Battery Supply Voltage
VBATH
Continuous
–130
0.4
V
10 ms
–135
0.4
V
Low Battery Supply Voltage
VBAT,
VBATL
Continuous
VBATH
0.4
V
TIP or RING Voltage
VTIP,
VRING
Continuous
–130
0.4
V
Pulse < 10 us
VBATH–15
0.4
V
Pulse < 4 us
VBATH–35
0.4
V
TIP or RING Current
ITIP, IRING
–100
+100
mA
Thermal Information
Operating temperature (All devices)4
–40
+100
C
Storage temperature (All devices)
–40
+150
C
Thermal Resistance (Si3220/Si3225)5
JA
TQFP-64 ePad
25 (typical)
C/W
Thermal Resistance (Si3200/Si3202)5
JA
SOIC-16 ePad
55 (typical)
C/W
Table 1. Absolute Maximum Ratings and Thermal Information1 (Continued)
Parameter
Symbol
Test Condition
Min
Max
Unit
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded, and exposure to absolute
maximum rating conditions for extended periods may affect device reliability. Functional operation should be restricted
to the conditions as specified in the operational sections of this data sheet.
2. The PCB pad placed under the device package must be connected with multiple vias to the PCB ground layer and to
the GND1-GND4 pins via short traces. The TQFP-64 e-Pad must be properly soldered to the PCB pad during PCB
assembly. This type of low-impedance grounding arrangement is necessary to ensure that maximum differentials are
not exceeded under any operating condition in addition to providing thermal dissipation.
3. On Si3200 revision E, the dv/dt of the voltage applied to the VBAT, VBATH, and VBATL pins must be limited to 10 V/s.
4. Operation of the Si3220/Si3225 above 125
C junction temperature may degrade device reliability. The Si3200/Si3202
should be operated at a junction temperature below 140
C for optimal reliability.
5. The thermal resistance of an exposed pad package is assured when the recommended printed circuit board layout
guidelines are followed correctly. The specified performance requires that the exposed pad be soldered to an exposed
copper surface of equal size and that multiple vias are added to enable heat transfer between the top-side copper
surface and a large internal copper ground plane. Refer to “AN55: Dual ProSLIC User Guide” or to the Si3220/3225
evaluation board data sheet for specific layout examples.
相關PDF資料
PDF描述
SI3201-FS IC LINEFEED INTRFC SI321X 16SOIC
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相關代理商/技術參數(shù)
參數(shù)描述
Si3200-G-GS 功能描述:射頻無線雜項 100 V Linefeed Inter IC unit price RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel
SI3200-G-GSR 功能描述:電信線路管理 IC 100 V Linefeed Interface RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
SI3200-GS 功能描述:射頻無線雜項 100 V Linefeed codec RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel
SI3200-GSR 制造商:Silicon Laboratories Inc 功能描述:
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