參數(shù)資料
型號: SLE22C05S-T85-C
廠商: INFINEON TECHNOLOGIES AG
英文描述: Security & Chip Card ICs
中文描述: 安全
文件頁數(shù): 3/7頁
文件大?。?/td> 32K
代理商: SLE22C05S-T85-C
SLE 22C05S
Short Product Information
3 / 8
11.01
16-bit Security Controller with
8-Kbytes ROM, 128 Bytes RAM and
512-Bytes EEPROM
Features
16-bit microcomputer in 0.6 μm CMOS
technology
Instruction set opcode compatible with
standard SAB 8051 processor
Enhanced 16-bit arithmetic
Additional powerful instructions optimized
for chip card applications
Dedicated, non-standard architecture with
execution time
six times faster
than
standard SAB 8051 processor
7.5-Kbytes User ROM
for application
programs
512-bytes reserved ROM for Resource
Management System (RMS) with intelligent
write/erase routines
512-Bytes EEPROM
as program/data
memory
128 bytes
RAM
CRC Module
Power saving sleep mode
Clock freq. = int. freq.: 1 to 7.5 MHz
Contact configuration and serial interface in
accordance with ISO 7816
Supply voltage range: 2.7 V to 5.5 V
Current consumption < 8 mA at 5 MHz and
5.5 V
Temperature range: -25 to +70°C
ESD protection larger than 4 kV
Testmode
Irreversible Lock - Out of testmode
Anti Snooping
HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis-DFA)
CRC - Module
Non standard dedicated Smart Card CPU
– Core
EEPROM
Reading, erasing and writing byte by byte
Flexible page mode for 1 to 8 bytes
write/erase operation
24 bytes security area
Write time 3.62 ms, erase time 1.81 ms
Minimum of 500,000 write/erase cycles
Data retention for a minimum of ten years
EEPROM programming voltage
generated on chip
Security Features
Operation state monitoring mechanism
Low and high voltage sensors
Frequency sensors and filters
Memory Security
8 bytes security PROM, hardware protected
Unique chip identification number for each
chip
MED – memory encryption/decryption device
for XRAM, ROM and EEPROM
Security optimised layout and layout
scrambling
Mask specific encryption key for EEPROM
Move code blocking (from EEPROM)
Document References
Confidential Data Book SLE 22CxxS
Confidential Instruction SET SLE 66CxxS
Confidential Quick Reference SLE 66CxxS
Qualification report
Chip delivery specification for wafer with
chip-layout (die size, orientation,...)
Module specification containing description
of package, etc.
Qualification report module
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