
KSD-O8Q005-001
2
SM2233-D
Absolute Maximum Ratings
(Ta=25
o
C)
Characteristic
Symbol
Power dissipation
P
D
Forward current
I
F
*
1
Peak forward current
I
FP
Reverse voltage
V
R
Operating temperature range
T
opr
Storage temperature range
T
stg
*
2
Soldering temperature
T
sol
*1. Duty ratio = 1/16, Pulse width = 0.1ms
*2. Recommended reflow soldering temperature profile
- Preheating 150
℃
to 185
℃
within 120 seconds soldering 240
℃
within 10 seconds
Gradual cooling (Avoid quenching)
Temp (
℃
)
Rating
63
25
50
4
-25
~
80
-30
~
100
240
℃
for 10 seconds
Unit
mW
mA
mA
V
℃
℃
Electrical Optical Characteristics
(Ta=25
o
C)
Characteristic
Symbol
Test Condition
Min
Typ. Max.
Unit
Forward voltage
V
F
I
F
= 20mA
-
2.1
2.5
V
Luminous intensity
I
V
λ
D
λ
I
R
I
F
= 20mA
17
-
-
mcd
Dominant wavelength
I
F
= 20mA
569
572
576
nm
Spectrum bandwidth
I
F
= 20mA
-
30
-
nm
Reverse current
V
R
=4V
-
-
10
uA
-
±
55
-
*
3
Half angle
θ
1/2
I
F
= 20mA
-
±
80
-
deg
*3.
θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity
(Do not use to combine grade classification. It must be used separately grade classification)
max. 10sec
Time (sec)
185
150
240
Peak Temp max. 240
℃
Preheating area
150~185
℃
, 90±30sec
max. 3
℃
/sec
25
Time from 25
℃
to Peak Temperature max. 6min
Solder area
220
℃
, max. 60sec
max. 4
℃
/sec
max. -6
℃
/sec
240
180
150
60
0