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參數(shù)資料
| 型號(hào)： | SM6S16A/2E |
| 廠商： | GENERAL SEMICONDUCTOR INC |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | 4600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-218AB |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大?。?/td> | 62K |
| 代理商： | SM6S16A/2E |
New
Product
Patented*
Maximum Ratings and Thermal Characteristics (TC = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Peak pulse power dissipation with 10/1000
s waveform
4600
10/10,000
s waveform
PPPM
3600
W
Steady state power dissipation
PD
6.0
W
Peak pulse current with a 10/1000
s waveform (NOTE 1)
IPPM
See Table 1
A
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) (NOTE 2)
IFSM
600
A
Typical thermal resistance junction to case
R
ΘJC
0.95
°C/W
Operating junction and storage temperature range
TJ, TSTG
–55 to +175
°C
Notes: (1) Non-repetitive current pulse derated above TA=25°C
0.093(2.4)
0.116(3.0)
0.059(1.5)
0.098(2.5)
0.138(3.5)
0.366(9.3)
0.343(8.7)
0.406(10.3)
0.382(9.7)
0.342(8.7)
0.327(8.3)
0.413(10.5)
0.374(9.5)
0.539(13.7)
0.524(13.3)
LEAD 2/METAL HEATSINK
0.020(0.5)
0.028(0.7)
0.012(0.3)
0.197(5.0)
0.185(4.7)
LEAD 1
0.628(16.0)
0.592(15.0)
*Patent #’s:
4,980,315
5,166,769
5,278,095
Features
Ideally suited for load dump protection
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
High temperature stability due to unique oxide passiva-
tion and patented PARconstruction
Integrally molded heatsink provides a very low thermal
resistance for maximum heat dissipation
Low leakage current at TJ = 175°C
High temperature soldering guaranteed:
260°C for 10 seconds at terminals
Meets ISO7637-2 surge spec.
Low forward voltage drop
SM6S Series
Surface Mount Automotive
Transient Voltage Suppressors
Stand-off Voltage 10 to 36V
Peak Pulse Power 4600W (10/1000
s)
3600W (10/10,000
s)
0.413(10.5)
0.374(9.5)
0.366(9.3)
0.343(8.7)
0.606(15.4)
0.583(14.8)
0.150(3.8)
0.126(3.2)
0.091(2.3)
0.067(1.7)
0.116(3.0)
0.093(2.4)
Mounting Pad Layout
8/23/00
Mechanical Data
Case: Molded plastic body, surface mount with heatsink
integrally mounted in the encapsulation
Terminals: Plated, solderable per MIL-STD-750, Method 2026
Polarity: Heatsink is anode
Mounting Position: Any
Weight: 0.091oz., 2.58g
Packaging codes/options:
2D/750 per 13” Reel (16mm Tape),
anode towards sprocket hole, 4.5K/box
2E/750 per 13” Reel (16mm Tape),
cathode towards sprocket hole, 4.5K/box
DO-218AB
Dimensions in
inches and (millimeters)
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