參數(shù)資料
型號(hào): SN54AHCT174W
廠商: Texas Instruments, Inc.
英文描述: HEX D-TYPE FLIP-FLOPS WITH CLEAR
中文描述: 六角D型倒裝,沒(méi)有明確的觸發(fā)器
文件頁(yè)數(shù): 2/6頁(yè)
文件大?。?/td> 101K
代理商: SN54AHCT174W
SN54AHCT174, SN74AHCT174
HEX D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS419E – JUNE 1998 – REVISED JANUARY 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
logic symbol
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
R
1
9
CLK
C1
1D
3
1D
4
2D
6
3D
11
4D
13
5D
14
6D
1Q
2
2Q
5
3Q
7
4Q
10
5Q
12
6Q
15
CLR
logic diagram (positive logic)
1D
C1
R
To Five Other Channels
1
9
3
2
CLR
CLK
1D
1Q
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input voltage range, V
I
(see Note 1)
Output voltage range, V
O
(see Note 1)
Input clamp current, I
IK
(V
I
< 0)
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
)
Continuous output current, I
O
(V
O
= 0 to V
CC
)
Continuous current through V
CC
or GND
Package thermal impedance,
θ
JA
(see Note 2): D package
–0.5 V to 7 V
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
–0.5 V to V
CC
+ 0.5 V
–20 mA
±
20 mA
±
25 mA
±
50 mA
73
°
C/W
82
°
C/W
120
°
C/W
67
°
C/W
108
°
C/W
–65
°
C to 150
°
C
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