![](http://datasheet.mmic.net.cn/300000/SN54S11W_datasheet_16214702/SN54S11W_5.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CDIP
CFP
LCCC
CDIP
CFP
CDIP
CDIP
SOIC
Package
Drawing
J
W
FK
J
W
J
J
D
Pins Package
Qty
1
1
1
1
1
1
1
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
JM38510/08001BCA
JM38510/08001BDA
JM38510/31001B2A
JM38510/31001BCA
JM38510/31001BDA
SN54LS11J
SN54S11J
SN74LS11D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
14
14
20
14
14
14
14
14
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
None
None
None
None
None
None
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
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Level-NC-NC-NC
SN74LS11DR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
SN74LS11J
SN74LS11N
OBSOLETE
ACTIVE
CDIP
PDIP
J
N
14
14
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CU NIPDAU
25
SN74LS11N3
SN74LS11NSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
14
14
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CU NIPDAU
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
2000
SN74S11D
SN74S11N
SN74S11N3
SNJ54LS11FK
SNJ54LS11J
SNJ54LS11W
SNJ54S11FK
SNJ54S11J
SNJ54S11W
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
PDIP
PDIP
LCCC
CDIP
CFP
LCCC
CDIP
CFP
D
N
N
FK
J
W
FK
J
W
14
14
14
20
14
14
20
14
14
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1
1
1
1
1
1
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1