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參數(shù)資料
| 型號(hào)： | SN74HC04QPWRQ1 |
| 廠(chǎng)商： | Texas Instruments, Inc. |
| 元件分類(lèi)： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁(yè)數(shù)： | 2/7頁(yè) |
| 文件大?。?/td> | 119K |
| 代理商： | SN74HC04QPWRQ1 |
SCLS583 MAY 2004
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 1)
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 1)
Continuous output current, I
O
(V
O
= 0 to V
CC
)
Continuous current through V
CC
or GND
Package thermal impedance,
θ
JA
(see Note 2)
Storage temperature range, T
stg
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
0.5 V to 7 V
±
20 mA
±
20 mA
±
25 mA
±
50 mA
113
°
C/W
65
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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recommended operating conditions (see Note 3)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
1.5
VIH
High-level input voltage
3.15
V
4.2
0.5
VIL
Low-level input voltage
1.35
V
1.8
VI
VO
Input voltage
0
VCC
VCC
1000
V
Output voltage
0
V
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
I-suffix device
Q-suffix device
t/
v
Input transition rise/fall time
500
ns
400
TA
Operating free-air temperature
40
40
85
125
°
C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
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