參數(shù)資料
型號： SN74LS374NSRG4
廠商： Texas Instruments, Inc.
英文描述： OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
中文描述： 八路D型透明鎖存器和邊沿觸發(fā)觸發(fā)器
文件頁數(shù)： 8/28頁
文件大小： 685K
代理商： SN74LS374NSRG4
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74S374N
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S374N3
OBSOLETE
PDIP
N
20
TBD
Call TI
SN74S374NE4
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S374NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S374NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S374NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS373FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54LS373J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS373W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
SNJ54LS374FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54LS374J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS374W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
SNJ54S373FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54S373J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S374FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54S374J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S374W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Addendum-Page 3
相關(guān)PDF資料
PDF描述
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SN74LV174ADGVRE4 HEX D-TYPE FLIP-FLOPS WITH CLEAR
SN74LV174ADGVRG4 HEX D-TYPE FLIP-FLOPS WITH CLEAR
SN74LV174ADGVR HEX D-TYPE FLIP-FLOPS WITH CLEAR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SN74LS375 制造商:Fairchild Semiconductor 功能描述:74LS375 FSC85
SN74LS375D 功能描述:閉鎖 Quad bistable latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
SN74LS375DE4 功能描述:閉鎖 Quad bistable latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
SN74LS375DG4 功能描述:閉鎖 Quad bistable latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
SN74LS375DR 功能描述:閉鎖 Quad bistable latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
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