參數(shù)資料
型號(hào): SN74LVC2G17YEPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6
封裝: DSBGA-6
文件頁數(shù): 1/15頁
文件大?。?/td> 422K
代理商: SN74LVC2G17YEPR
www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOMVIEW)
2
GND
V
CC
5
3
4
2A
2Y
6
1
1A
1Y
3
4
2A
2
GND
2Y
5
1
1A
V
CC
6
1Y
2
GND
V
CC
1
5
1A
2A
4
3
2Y
6
1Y
DESCRIPTION/ORDERING INFORMATION
DUAL SCHMITT-TRIGGER BUFFER
SCES381F – JANUARY 2002 – REVISED SEPTEMBER 2006
Available in the Texas Instruments
Typical V
OHV (Output VOH Undershoot)
NanoStar and NanoFree Packages
>2 V at V
CC = 3.3 V, TA = 25°C
Supports 5-V V
CC Operation
I
off Supports Partial-Power-Down Mode
Operation
Inputs Accept Voltages to 5.5 V
Latch-Up Performance Exceeds 100 mA Per
Max t
pd of 5.4 ns at 3.3 V
JESD 78, Class II
Low Power Consumption, 10-
A Max I
CC
ESD Protection Exceeds JESD 22
±24-mA Output Drive at 3.3 V
– 2000-V Human-Body Model (A114-A)
Typical V
OLP (Output Ground Bounce)
– 1000-V Charged-Device Model (C101)
<0.8 V at V
CC = 3.3 V, TA = 25°C
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
SN74LVC2G17YEAR
0.17-mm Small Bump – YEA
NanoFree – WCSP (DSBGA)
SN74LVC2G17YZAR
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
_ _ _C7_
NanoStar – WCSP (DSBGA)
SN74LVC2G17YEPR
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree – WCSP (DSBGA)
SN74LVC2G17YZPR
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC2G17DBVR
SOT (SOT-23) – DBV
C17_
Reel of 250
SN74LVC2G17DBVT
Reel of 3000
SN74LVC2G17DCKR
SOT (SC-70) – DCK
C7_
Reel of 250
SN74LVC2G17DCKT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2002–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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