參數(shù)資料
型號: SN74LVC3G04DCUT
廠商: Texas Instruments
文件頁數(shù): 14/16頁
文件大?。?/td> 0K
描述: IC TRIPLE INVERTER GATE 8-US8
標(biāo)準(zhǔn)包裝: 250
系列: 74LVC
邏輯類型: 逆變器,緩沖器
電路數(shù): 3
輸入數(shù): 1
電源電壓: 1.65 V ~ 5.5 V
電流 - 靜態(tài)(最大值): 10µA
輸出電流高,低: 32mA,32mA
邏輯電平 - 低: 0.7 V ~ 0.8 V
邏輯電平 - 高: 1.7 V ~ 2 V
額定電壓和最大 CL 時的最大傳播延遲: 3.2ns @ 5V,50pF
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: US8
封裝/外殼: 8-VFSOP(0.091",2.30mm 寬)
包裝: 帶卷 (TR)
其它名稱: 296-32332-2
SN74LVC3G04DCUT-ND
PACKAGE OPTION ADDENDUM
www.ti.com
24-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
SN74LVC3G04DCTR
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C04
Z
SN74LVC3G04DCTRE4
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C04
Z
SN74LVC3G04DCTRG4
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C04
Z
SN74LVC3G04DCUR
ACTIVE
US8
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(C04Q ~ C04R)
SN74LVC3G04DCURE4
ACTIVE
US8
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(C04Q ~ C04R)
SN74LVC3G04DCURG4
ACTIVE
US8
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(C04Q ~ C04R)
SN74LVC3G04DCUT
ACTIVE
US8
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(C04Q ~ C04R)
SN74LVC3G04DCUTE4
ACTIVE
US8
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(C04Q ~ C04R)
SN74LVC3G04YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(CC7 ~ CCN)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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