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參數(shù)資料
| 型號(hào)： | SN7ALS1035DR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | HEX NONINVERTING BUFFERS WITH OPEN-COLLECTOR OUTPUTS |
| 中文描述： | 六角同相緩沖器，集電極開路輸出 |
| 文件頁(yè)數(shù)： | 6/15頁(yè) |
| 文件大?。?/td> | 609K |
| 代理商： | SN7ALS1035DR |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CFP
CDIP
SOIC
Package
Drawing
FK
J
W
J
D
Pins Package
Qty
1
1
1
1
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-88742012A
5962-8874201CA
5962-8874201DA
SN54ALS1035J
SN74ALS1035D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
20
14
14
14
14
TBD
TBD
TBD
TBD
POST-PLATE
A42 SNPB
A42
A42 SNPB
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
1
1
1
SN74ALS1035DE4
ACTIVE
SOIC
D
14
50
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035DG4
ACTIVE
SOIC
D
14
50
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035DR
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035DRE4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035DRG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035N
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
SN74ALS1035NE4
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
SN74ALS1035NSR
ACTIVE
SO
NS
14
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035NSRE4
ACTIVE
SO
NS
14
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS1035NSRG4
ACTIVE
SO
NS
14
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ALS1035FK
SNJ54ALS1035J
SNJ54ALS1035W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
W
20
14
14
TBD
TBD
TBD
POST-PLATE
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 1
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