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參數(shù)資料
| 型號(hào)： | SNJ54AHC05FK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | HEX INVERTERS WITH OPEN-DRAIN OUTPUTS |
| 中文描述： | 十六進(jìn)制逆變器為開漏輸出 |
| 文件頁(yè)數(shù)： | 6/13頁(yè) |
| 文件大?。?/td> | 333K |
| 代理商： | SNJ54AHC05FK |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74AHC05D
ACTIVE
14
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DBR
ACTIVE
SSOP
DB
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DBRE4
ACTIVE
SSOP
DB
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DE4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DGVR
ACTIVE
TVSOP
DGV
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DGVRE4
ACTIVE
TVSOP
DGV
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DR
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05DRE4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05N
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
SN74AHC05NE4
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
SN74AHC05PW
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05PWE4
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05PWG4
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05PWR
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05PWRE4
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC05PWRG4
ACTIVE
TSSOP
PW
14
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
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