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參數(shù)資料
| 型號： | SP4501EY |
| 英文描述： | EL Plus Piezo Driver |
| 中文描述： | 壓電驅(qū)動發(fā)光加 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 137K |
| 代理商： | SP4501EY |
11-14-00
SP4501 EL Plus Piezo Driver
2
Copyright 2000 Sipex Corporation
SPECIFICATIONS
V
DD
= +3.0V, L = 470
μ
H, C
LAMP
= 8nF, C
PZ
= 16nF, CINT = 1800pF R
OSC
= 500k
, and T
AMB
= 25C unless otherwise noted.
STORAGE CONSIDERATIONS
Storage in a low humidity environment is preferred.
Large high density plastic packages are moisture sen-
sitive and should be stored in Dry Vapor Barrier Bags.
Prior to usage, the parts should remain bagged and
stored below 40
°
C and 60%RH. If the parts are
removed from the bag, they should be used within 48
hours or stored in an environment at or below 20%RH.
If the above conditions cannot be followed, the parts
should be baked for four hours at 125
°
C in order
remove moisture prior to soldering. Sipex ships prod-
uct in Dry Vapor Barrier Bags with a humidity indicator
card and desiccant pack. The humidity indicator should
be below 30%RH.
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Power Supply, V
.................................................7.0V
Input Voltages, Logic.....................-0.3V to (V
+0.3V)
Lamp Outputs...................................................220V
Operating Temperature.........................-40C to +85C
Storage Temperature..........................-65C to +150C
Power Dissipation Per Package
14-pin SOIC
(derate 8.33mW/C above +70C)....................700mW
14-pin TSSOP
(derate 9.96mW/C above +70C)....................800mW
The information furnished by Sipex has been carefully
reviewed for accuracy and reliability. Its application or
use, however, is solely the responsibility of the user. No
responsibility for the use of this information become
part of the terms and conditions of any subsequent
sales agreement with Sipex. Specifications are subject
to change without no responsibility for any infringement
of patents or other rights of third parties which may
result from its use. No license or other proprietary rights
are granted by implication or otherwise under any
patent or patent rights of Sipex Corporation.
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