參數(shù)資料
型號: SP6828EK
英文描述: +3V Low Power Voltage Inverters
中文描述: 3V的低功率高壓變頻器
文件頁數(shù): 14/17頁
文件大?。?/td> 258K
代理商: SP6828EK
14
SP6828DS/11 SP6828/6829 +3V Low Power Voltage Inverter Copyright 2000 Sipex Corporation
Combining a Doubler and Inverter Circuit
A designer can connect a
SP6828/6829
device in
a combination doubler/inverter circuit as seen in
Figure 24
. The doubler uses capacitors C3 and
C4 while the inverter uses C1 and C2. Loading
either output decreases both output voltages to
GND because both the doubler and the inverter
circuits use the charge pump. Designers should
not allow the total current output from the doubler
and the inverter to exceed 40mA.
Implementing Shutdown
If shutdown control of the
SP6828/6829
devices
is necessary, the circuit found in
Figure 25
can
be implemented. The 0.1
μ
F capacitor at IN
absorbs transient input currents. The output
resistance of the devices can be determined by
the following equation:
R
OUT
= 20 + 2 x R
BUFFER
,
where R
is the output resistance and R
is the output resistance of the buffer driving IN.
R
can be reduced by connecting multiple
buffers in parallel at IN. The polarity of the
SHUTDOWN signal can be changed by using a
noninverting buffer to drive IN.
Connecting in Parallel
A designer can parallel a number of
SP6828/
6829
devices to reduce the output resistance for
specific designs. All devices will need their own
flying capacitor, C1, but a single output capacitor
will serve all of the devices connected in parallel
by increasing the capacitance of C2 by a factor of
n where n equals the total number of devices
connected. This connection can be found in
Figure 26
.
Cascading Devices
A designer can cascade
SP6828/6829
devices to
produce a larger inverted voltage output. Refer
to
Figure 27
for this circuit connection. With
two cascaded devices, the unloaded output
voltage is decreased by the output resistance of
the first device multiplied by the quiescent current
of the second device connected. The total output
resistance is greatly increased when more than
two devices are cascaded.
Layout and Grounding
Designers should make an effort to minimize
noise by paying special attention to the circuit
layout with the
SP6828/6829
devices. External
components should be connected in close
proximity to the device and a ground plane
should be implemented. This will keep electrical
traces short minimizing parasitic inductance and
capacitance.
Figure 25. SP6828/6829 Device with Shutdown Control
OUT
SP6828
SP6829
C1
1
5
3
C2
C1+
C1-
GND
2
4
IN
+V
IN
V
OUT
C
IN
0.1
μ
F
Shutdown
Logic
OFF
ON
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