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參數(shù)資料
| 型號(hào)： | SP708SEU |
| 英文描述： | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| 中文描述： | 3.0V / 3.3V低功耗微處理器監(jiān)控電路 |
| 文件頁數(shù)： | 2/18頁 |
| 文件大?。?/td> | 213K |
| 代理商： | SP708SEU |
2
Rev. 10-17-00 SP706 +3.0/ +3.3 Low Power Microprocessor Circuits Copyright 2000 Sipex Corporation
SPECIFICATIONS
V
= 2.7V to 5.5V for SP70_P/R, V
CC
= 3.0 to 5.5V for SP70_S, V
CC
= 3.15V to 5.5V for SP70_T, T
A
= T
MIN
to T
MAX
to T
MAX
, unless otherwise noted,
typical at 25
°
C.
R
E
T
E
M
A
R
A
P
.
N
I
M
.
P
Y
T
V
,
g
n
a
R
e
g
a
V
g
n
p
O
C
C
0
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability.
Terminal Voltage (with respect to GND):
V
........................................................-0.3V to +6.0V
All Other Inputs (Note 1)..............-0.3V to (V
CC
+3.0V)
Input Current:
V
.....................................................................20mA
GND...................................................................20mA
Output Current (all outputs)...............................20mA
ESD Rating...........................................................2kV
.
X
A
M
5
S
T
N
V
U
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2
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4
μ
A
V
0
0
0
=
7
7
7
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5
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8
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3
3
8
6
9
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2
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5
7
0
1
V
_
_
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2
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e
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m
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μ
A
A
=
μ
A
)
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s
n
V
,
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I
V
x
8
=
C
C
,
h
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C
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=
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(
C
C
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C
C
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p
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1
μ
A
V
0
C
C
Continuous Power Dissipation
Plastic DIP
(derate 9.09mW/
O
C above +70
O
C)..................727mW
SO
(derate 5.88mW/
O
C above +70
O
C)..................471mW
Mini SO
(derate 4.10mW/
O
C above +70
O
C)..................330mW
Storage Temperature Range.............-65C to +160C
Lead Temperature (solding 10 sec)................+300C
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SP708TCU | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| SP708TEN | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| SP708TEP | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| SP708TEU | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| SP708TCN | +3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SP708T | 制造商:SIPEX 制造商全稱:Sipex Corporation 功能描述:+3.0V/+3.3V Low Power Microprocessor Supervisory Circuits |
| SP708TCN | 制造商:Exar Corporation 功能描述: |
| SP708TCNL | 制造商:Exar Corporation 功能描述: |
| SP708TCN-L | 功能描述:監(jiān)控電路 LOW PWR MICROPROCESSOR RoHS:否 制造商:STMicroelectronics 監(jiān)測電壓數(shù): 監(jiān)測電壓: 欠電壓閾值: 過電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel |
| SP708TCN-L/TR | 功能描述:監(jiān)控電路 LOW PWR MICROPROCESSOR RoHS:否 制造商:STMicroelectronics 監(jiān)測電壓數(shù): 監(jiān)測電壓: 欠電壓閾值: 過電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel |
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