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6-4
ESD Capability
ESD capability is dependent on the application and defined
test standard. The evaluation results for various test
standards and methods based on Figure 1 are shown in
Table 1.
For the “Modified” MIL-STD-3015.7 condition that is defined
as an “in-circuit” method of ESD testing, the V+ and V- pins
have a return path to ground and the SP720 ESD capability
is typically greater than 15kV from 100pF through 1.5k
strict definition of MIL-STD-3015.7 using “pin-to-pin” device
testing, the ESD voltage capability is greater than 6kV. The
MIL-STD-3015.7 results were determined from AT&T ESD
Test Lab measurements.
. By
The HBM capability to the IEC 1000-4-2 standard is greater
than 15kV for air discharge (Level 4) and greater than 4kV
for direct discharge (Level 2). Dual pin capability (2 adjacent
pins in parallel) is well in excess of 8kV (Level 4).
For ESD testing of the SP720 to EIAJ IC121 Machine Model
(MM) standard, the results are typically better than 1kV from
200pF with no series resistance.
Absolute Maximum Ratings
Thermal Information
Continuous Supply Voltage, (V+) - (V-) . . . . . . . . . . . . . . . . . . +35V
Forward Peak Current, I
IN
to V
CC
, I
(Refer to Figure 6) . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
IN
to GND
±
2A, 100
μ
s
Thermal Resistance (Typical, Note 1) . . . . . . . . . . . . .
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Storage Temperature Range. . . . . . . . . . -65
Maximum Junction Temperature (Plastic Package) . . . . . . . . .150
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
(SOIC Lead Tips Only)
θ
JA
(
o
C/W)
90
130
C to 150
o
o
o
o
C
C
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
T
A
= -40
o
C to 105
o
C; V
IN
= 0.5V
CC
, Unless Otherwise Specified
PARAMETER
SYMBOL
V
SUPPLY
TEST CONDITIONS
MIN
-
TYP
2 to 30
MAX
-
UNITS
V
Operating Voltage Range,
V
SUPPLY
= [(V+) - (V-)]
Forward Voltage Drop:
IN to V-
IN to V+
Input Leakage Current
Quiescent Supply Current
Equivalent SCR ON Threshold
Equivalent SCR ON Resistance
Input Capacitance
Input Switching Speed
NOTES:
2. In automotive and battery operated systems, the power supply lines should be externally protected for load dump and reverse battery. When the
V+ and V- pins are connected to the same supply voltage source as the device or control line under protection, a current limiting resistor should
be connected in series between the external supply and the SP720 supply pins to limit reverse battery current to within the rated maximum
limits. Bypass capacitors of typically 0.01
μ
F or larger from the V+ and V- pins to ground are recommended.
3. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance.” These characteristics are given here
for thumb-rule information to determine peak current and dissipation under EOS conditions.
V
V
FWDL
FWDH
I
IN
I
IN
= 1A (Peak Pulse)
-
-
2
2
5
50
1.1
1
3
2
-
-
V
V
nA
nA
V
pF
ns
-20
-
-
-
-
-
20
200
-
-
-
-
I
QUIESCENT
Note 3
/I
FWD
V
FWD
; Note 3
C
t
ON
IN
TABLE 1. ESD TEST CONDITIONS
STANDARD
MIL STD 3015.7 Modified HBM
TYPE/MODE
R
D
C
D
±
15kV
6kV
15kV
4kV
8kV
V
D
1.5k
1.5k
330
330
330
100pF
100pF
150pF
150pF
150pF
Standard HBM
HBM, Air Discharge
HBM, Direct Discharge
HBM, Direct Discharge,
Two Parallel Input Pins
Machine Model
IEC 1000-4-2
EIAJ IC121
0k
200pF
1kV
H.V.
SUPPLY
°
±
V
D
IN
DUT
C
D
R
1
IEC 1000-4-2: R
1
50 to 100M
MIL STD 3015.7: R
1
1 to 10M
R
D
CHARGE
SWITCH
DISCHARGE
SWITCH
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
SP720