參數(shù)資料
型號: SP828
英文描述: High Efficiency Voltage Inverters
中文描述: 高效高壓變頻器
文件頁數(shù): 13/16頁
文件大?。?/td> 259K
代理商: SP828
13
SP828DS/03 SP828/829 High Efficiency Voltage Inverters Copyright 1999 Sipex Corporation
Combining a Doubler and Inverter Circuit
A designer can connect a
SP828/829
device in a
combination doubler/inverter circuit as seen in
Figure 24
. The doubler uses capacitors C3 and
C4 while the inverter uses C1 and C2. Loading
either output decreases both output voltages to
GND because both the doubler and the inverter
circuits use the charge pump. Designers should
not allow the total current output from the doubler
and the inverter to exceed 40mA.
Implementing Shutdown
If shutdown control of the
SP828/829
devices is
necessary, the circuit found in
Figure 25
can be
implemented. The 0.1
μ
F capacitor at IN absorbs
transient input currents. The output resistance of
the devices can be determined by the following
equation:
R
OUT
= 20 + 2 x R
BUFFER
,
where R
is the output resistance and R
is the output resistance of the buffer driving IN.
R
can be reduced by connecting multiple
buffers in parallel at IN. The polarity of the
SHUTDOWN signal can be changed by using a
noninverting buffer to drive IN.
Connecting in Parallel
A designer can parallel a number of
SP828/829
devices to reduce the output resistance for specific
designs. All devices will need their own flying
capacitor, C1, but a single output capacitor will
serve all of the devices connected in parallel by
increasing the capacitance of C2 by a factor of n
where n equals the total number of devices
connected. This connection can be found in
Figure 26
.
Cascading Devices
A designer can cascade
SP828/829
devices to
produce a larger inverted voltage output. Refer
to
Figure 27
for this circuit connection. With two
cascaded devices, the unloaded output voltage is
decreased by the output resistance of the first
device multiplied by the quiescent current of the
second device connected. The total output
resistance is greatly increased when more than
two devices are cascaded.
Layout and Grounding
Designers should make an effort to minimize
noise by paying special attention to the circuit
layout with the
SP828/829
devices. External
components should be connected in close
proximity to the device and a ground plane
should be implemented. This will keep electrical
traces short minimizing parasitic inductance and
capacitance.
Figure 25. SP828/829 Device with Shutdown Control
OUT
SP828
SP829
C1
1
5
3
C2
C1+
C1-
GND
2
4
IN
+V
IN
V
OUT
C
IN
0.1
μ
F
Shutdown
Logic
OFF
ON
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