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參數(shù)資料
| 型號： | SPR12 |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 1 A, 200 V, SILICON, SIGNAL DIODE, DO-41 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 161K |
| 代理商： | SPR12 |
MECHANICAL DATA
FEATURES
Data Sheet No. SESA-100-1B
MECHANICAL SPECIFICATION
Case: JEDEC DO-41 molded plastic (U/L Flammability Rating 94V-0)
Terminals: Plated axial leads
Solderability: Per MIL-STD 202 Method 208 guaranteed
Polarity: Color band denotes cathode
Mounting Position: Any
Weight: 0.013 Ounces (0.35 Grams)
C1
(1) Measured at1 MHz and an applied reverse voltage of4 volts.
ACTUAL SIZE OF
DO-41 PACKAGE
Sym
In
mm
Minimum
Maximum
BL
BD
LL
LD
1.00
0.028
In
mm
0.107
0.205
0.034
5.2
2.7
0.86
0.160
0.103
25.4
0.71
4.1
2.6
Color Band
Denotes
Cathode
LD (Dia)
BD (Dia)
LL
BL
LL
Average Forward Rectified Current@ T = 55 C
A
o
Peak Forward Surge Current( 8.3mS single half sine wave
superimposed on rated load)
Maximum Forward Voltage at1 Amp DC
IO
VOLTS
AMPS
VFM
IFSM
1
30
0.95
1.25
Typical Thermal Resistance, Junction to Ambient
Junction Operating and Storage Temperature Range
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
IRM
R
θJA
TJ, TSTG
°C/W
°C
A
Typical Junction Capacitance (Note 1)
CJ
pF
@ T= 25 C
C
o
@ T = 100 C
C
o
2.0
50
-65 to +150
4.97fsesa1
NOTES:
MAXIMUM RATINGS& ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
VRMS
VRRM
VRM
SYMBOL
SPR11
RATINGS
UNITS
VOLTS
SPR12
SPR13
SPR14
100
200
300
400
70
140
210
280
Maximum Reverse Recovery Time (I =0.5A, I =1A, I
=0.25A)
F
R
RR
TRR
35
nSec
SERIES SPR11- SPR14
DO- 41
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
LOW SWITCHING NOISE
LOW THERMAL RESISTANCE
HIGH SWITCHING CAPABILITY
LOW FORWARD VOLTAGE DROP
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical< 2%, Max.< 10% of Die Area)
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