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參數(shù)資料
| 型號： | SPT1175ACU |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 8-BIT, 20 MSPS CMOS A/D CONVERTER |
| 中文描述： | 8位，20 MSPS的的CMOS A / D轉(zhuǎn)換 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 76K |
| 代理商： | SPT1175ACU |
SPT
8
6/24/97
SPT1175
V
RT
20
25
AGND
N/C
22
21
AV
DD
19
V
RTS
11
D6
10
D5
9
D4
8
N/C
7
D3
6
D2
5
D1
2
2
2
1
4
2
3
V
R
V
R
D
N
D
D
O
AGND
22
23
V
IN
1
D
1
D
1
1
D
1
1
1
D
OE
DGND
D (LSB)
D1
D2
D3
D4
D5
D6
D7 (MSB)
DVDD
CLK
DGND
VRB
VRBS
AGND
AGND
VIN
AVDD
VRT
VRTS
AVDD
AVDD
DVDD
PIN ASSIGNMENTS
DIP and
SOIC
PLCC
PIN FUNCTIONS
Name
OE
Function
Tri-State Output Enable
Tri-State When
OE
= DV
DD
,
Enable When
Digital Ground
Digital Output Data (LSB)
Digital Output Data
Digital Output Data (MSB)
Digital Supply
CMOS Digital Clock Input
Analog Supply
Internal Self-Biased Reference Top
Shorted with V
RT
(pin 17). Generates 2.6 V.
Reference Resistor Top Side
Analog Input
Analog Ground
Internal Self-Biased Reference Bottom
Shorted with V
RB
(pin 23). Generates 0.6 V.
Reference Resistor Bottom Side
OE
= DGND
DGND
D0
D1-6
D7
DV
DD
CLK
AV
DD
V
RTS
V
RT
V
IN
AGND
V
RBS
V
RB
ORDERING INFORMATION
PART NUMBER
SPT1175ACN
SPT1175ACP
SPT1175ACS
SPT1175ACU
*See the die specification for guaranteed electrical performance.
TEMPERATURE RANGE
0 to +70
°
C
0 to +70
°
C
0 to +70
°
C
+25
°
C
PACKAGE TYPE
24L Plastic Dip
28L PLCC
24L SOIC
Die*
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
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