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參數(shù)資料
| 型號： | SPT774CCS |
| 廠商： | SIGNAL PROCESSING TECHNOLOGIES |
| 元件分類： | ADC |
| 英文描述： | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO28 |
| 封裝： | SOIC-28 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 113K |
| 代理商： | SPT774CCS |
SPT
12
8/1/00
SPT774
PIN ASSIGNMENTS
PIN FUNCTIONS
NAME
FUNCTION
VDD
Logic Supply Voltage, Nominally +5 V
12/8
Data Mode Selection
CS
Chip Selection
Ao
Byte Address/Short Cycle
R/C
Read/Convert
CE
Chip Enable
VEE
Mode Control Voltage, Nominally +5 V
REF OUT
Reference Output, Nominally +2.5 V
AGND
Analog Ground
REF IN
Reference Input
N/C
Pin Not Connected to Device
BIP OFF
Bipolar Offset
10 V IN
10 Volt Analog Input
20 V IN
20 Volt Analog Input
DGND
Digital Ground
DB0 - DB11
Digital Data Output
DB11 - MSB
DB0 - LSB
STS
Status
STS
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
DGND
15
21
23
24
26
28
16
17
18
19
20
22
25
27
1
2
4
3
5
6
7
8
9
10
11
12
13
14
VDD
Ao
CE
N/C
REF OUT
AGND
REF IN
VEE
BIP OFF
10 V IN
20 V IN
12/8
R/C
CS
28-LEAD DIP/SOIC
ORDERING INFORMATION
LINEARITY ERROR
PACKAGE
PART NUMBER
TEMPERATURE RANGE
MAX
TYPE
SPT774BCN
0 to +70
°C
±1/2 LSB
28L Plastic DIP
SPT774BCJ
0 to +70
°C
±1/2 LSB
28L Sidebrazed DIP
SPT774BCS
0 to +70
°C
±1/2 LSB
28L SOIC
SPT774CCN
0 to +70
°C
±1 LSB
28L Plastic DIP
SPT774CCJ
0 to +70
°C
±1 LSB
28L Sidebrazed DIP
SPT774CCS
0 to +70
°C
±1 LSB
28L SOIC
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
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