參數(shù)資料
型號： STPC0310BTI3
廠商： 意法半導體
英文描述： PC Compatible Embeded Microprocessor
中文描述： PC兼容嵌入式微處理器
文件頁數(shù)： 40/51頁
文件大?。?/td> 726K
代理商： STPC0310BTI3
MECHANICAL DATA
40/51
Issue 1.2
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Structure in shown in Figure 5-4.
Thermal dissipation options are illustrated in Fig-
ure 5-5 and Figure 5-6.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal dissipation without heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13
°
C/W
Airflow = 0
Board temperature taken at the center balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17
μ
m for internal layers
- 34
μ
m for external layers
相關(guān)PDF資料
PDF描述
STPC0366BTC3 PC Compatible Embeded Microprocessor
STPC0366BTI3 PC Compatible Embeded Microprocessor
STPC0375BTC3 PC Compatible Embeded Microprocessor
STPC0375BTI3 PC Compatible Embeded Microprocessor
STPC0380BTC3 PC Compatible Embeded Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
STPC0366BTC3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor
STPC0366BTI3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor
STPC0375BTC3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor
STPC0375BTI3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor
STPC0380BTC3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*