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參數(shù)資料
| 型號(hào)： | STPC0366BTC3 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | PC Compatible Embeded Microprocessor |
| 中文描述： | PC兼容嵌入式微處理器 |
| 文件頁(yè)數(shù)： | 44/51頁(yè) |
| 文件大小： | 726K |
| 代理商： | STPC0366BTC3 |
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BOARD LAYOUT
44/51
Issue 1.2
When considering thermal dissipation, the most
important - and not the more obvious - part of the
layout is the connection between the ground balls
and the ground layer.
A 1-wire connection is shown in Figure 6-2. The
use of a 8-mil wire results in a thermal resistance
of 105
°
C/W assuming copper is used (418 W/
m.
°
K). This high value is due to the thickness (34
μ
m) of the copper on theexternal side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9
°
C/W. This can be easily im-
proved by using four 10 milwires to connect to the
four vias around the ground pad link as in Figure
6-3. This gives a total of 49 vias and a global resis-
tance for the 36 thermal balls of 0.6
°
C/W.
The use of a ground plane like in Figure 6-4 is
even better.
To avoid solder wickingover to the via padsduring
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad), this gives a di-
ameter of 33mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal boar d distortion is tolerated.
The thickness of the copper on PCB layers is typ-
ically 34
μ
m for external layers and 17
μ
m for inter-
nal layers. This means thermal dissipation is not
good and temperature of the board is concentrat-
ed around the devices and falls quickly with in-
creased distance.
When it is possible to place a metal layer inside
the PCB, this improves dramatically the heat
spreading and hence thermal dissipation of the
board.
Figure 6-2. Recommended 1-wire ground pad layout
Figure 6-3. Recommended 4-wire ground pad layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 10 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
4 via pads for each ground ball
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| STPC0366BTI3 | PC Compatible Embeded Microprocessor |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPC0366BTI3 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPC0375BTC3 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPC0375BTI3 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPC0380BTC3 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPC0380BTI3 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
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