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參數(shù)資料
| 型號： | STPCD0113BTC3 |
| 元件分類： | 32位微控制器 |
| 英文描述： | 32-Bit Microprocessor |
| 中文描述： | 32位微處理器 |
| 文件頁數(shù)： | 54/61頁 |
| 文件大小： | 1007K |
| 代理商： | STPCD0113BTC3 |
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BOARD LAYOUT
54/61
Issue 2.2 - October 13, 2000
When considering thermal dissipation, the most
important - and not the more obvious - part of the
layout is the connection between the ground balls
and the ground layer.
A 1-wire connection is shown in
Figure 6-2
. The
use of a 8-mil wire results in a thermal resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
μm) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9°C/W. This can be easily im-
proved by using four 10 mil wires to connect to the
four vias around the ground pad link as in
Figure
6-3
. This gives a total of 49 vias and a global resis-
tance for the 36 thermal balls of 0.6°C/W.
The use of a ground plane like in
Figure 6-4
is
even better.
To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad), this gives a di-
ameter of 33 mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal board distortion is tolerated.
The thickness of the copper on PCB layers is typ-
ically 34 μm for external layers and 17 μm for inter-
nal layers. This means thermal dissipation is not
good and temperature of the board is concentrat-
ed around the devices and falls quickly with in-
creased distance.
When it is possible to place a metal layer inside
the PCB, this improves dramatically the heat
spreading and hence thermal dissipation of the
board.
Figure 6-2. Recommended 1-wire ground pad layout
Figure 6-3. Recommended 4-wire ground pad layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 10 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
4 via pads for each ground ball
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| STPCD0166BTA3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
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| STPCD0175BTC3 | 功能描述:微處理器 - MPU 75MHz x86 Embedded RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCD0175BTI3 | 功能描述:微處理器 - MPU 75MHz x86 Embedded RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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