參數(shù)資料
型號(hào): STPS3L60
廠商: STMICROELECTRONICS
元件分類(lèi): 整流器
英文描述: 3 A, 60 V, SILICON, RECTIFIER DIODE, DO-201AD
封裝: ROHS COMPLIANT, PLASTIC PACKAGE-2
文件頁(yè)數(shù): 8/11頁(yè)
文件大?。?/td> 143K
代理商: STPS3L60
Characteristics
STPS3L60
6/11
Doc ID 7505 Rev 6
Figure 15.
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 16.
Junction capacitance versus
reverse voltage applied
(typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
5
10
15
20
25
30
35
40
45
50
55
60
Tj=125°C
Tj=25°C
Tj=100°C
V (V)
R
I (mA)
R
10
100
1000
1
10
100
F=1MHz
Vosc=30mV
Tj=25°C
V (V)
R
C(pF)
Figure 17.
Forward voltage drop versus
forward current (high level)
Figure 18.
Forward voltage drop versus
forward current (low level)
0
5
10
15
20
25
30
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I
(A)
FM
V
(V)
FM
0
1
2
3
4
5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I
(A)
FM
V
(V)
FM
Figure 19.
Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
Figure 20.
Thermal resistance junction to
ambient versus copper surface
under each lead (SMBflat)
0
20
40
60
80
100
120
0.00.5
1.0
1.5
2.0
2.53.03.5
4.0
4.55.0
SMB
S(Cu)(cm)
R
(°C/W)
th(j-a)
copper thickness = 35 m
Expoxy printed circuit FR4,
0
20
40
60
80
100
120
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
SMB-Flat
S(Cu)(cm)
R
(°C/W)
th(j-a)
copper thickness = 35 m
Expoxy printed circuit FR4,
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