
STR91xFAx32 STR91xFAx42 STR91xFAx44
Package mechanical data
93/99
Figure 39.
144-ball low profile fine pitch ball grid array package (LFBGA144)
Figure 40.
Recommended PCB Design rules (0.80/0.75mm pitch BGA)
Dim.
mm
inches
1)
Min
Typ
Max
Min
Typ
Max
A
1.21
1.70
0.0476
0.0669
A1
0.21
0.0083
A2
1.085
0.0427
b
0.35
0.40
0.45
0.0138 0.0157 0.0177
D
9.85
10.00 10.15 0.3878 0.3937 0.3996
D1
8.80
0.3465
E
9.85
10.00 10.15 0.3878 0.3937 0.3996
E1
8.80
0.3465
e
0.80
0.0315
F
0.60
0.0236
ddd
0.10
0.0039
eee
0.15
0.0059
fff
0.08
0.0031
Number of Pins
N
144
1
Values in inches are converted from mm and
rounded to 4 decimal digits.
Dpad
Dsm
Dpad
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Dsm
Solder paste