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參數(shù)資料
型號: SY10E212JC
廠商: Micrel Inc
文件頁數(shù): 3/4頁
文件大小: 0K
描述: IC REGISTER 3-BIT SCAN 28-PLCC
標準包裝: 38
系列: 10E
邏輯類型: 可掃描寄存器
電源電壓: 4.2 V ~ 5.5 V
位數(shù): 3
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-LCC(J 形引線)
供應商設(shè)備封裝: 28-PLCC
包裝: 管件
Micrel, Inc.
SY58606U
November 2011
3
M9999-110411-D
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC)............................... –0.5V to +4.0V
Input Voltage (VIN) .......................................–0.5V to VCC
CML Output Voltage (VOUT).......... VCC-1.0V to VCC+0.5V
Current (VT)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (IN, /IN) ................±50mA
Current (VREF)
Source or sink current on VREF-AC
(4) ..............±1.5mA
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VIN)........................ +2.375V to +3.60V
Ambient Temperature (TA) ................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN
Still-air (
θJA)............................................ 60°C/W
Junction-to-board (
ψJB) ......................... 33°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage Range
2.375
3.0
2.5
3.3
2.625
3.6
V
ICC
Power Supply Current
No load, max. VCC
60
77
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input HIGH Voltage
(IN, /IN)
IN, /IN, Note 7
VCC–1.6
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 6
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b
0.2
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
VT_IN
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψJB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
7. VIH (min) not lower than 1.2V.
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