Precision Edge SY89321L Micrel, Inc. M9999-060208 hbwhelp@micrel.com or (408) 955-1690 MICREL, INC. 2" />
參數(shù)資料
型號(hào): SY10EL15ZC TR
廠商: Micrel Inc
文件頁(yè)數(shù): 5/5頁(yè)
文件大?。?/td> 0K
描述: IC CLOCK BUFFER MUX 2:4 16-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: 100EL, Precision Edge®
類型: 扇出緩沖器(分配),多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 2:4
差分 - 輸入:輸出: 是/是
輸入: ECL,PECL
輸出: ECL,PECL
電源電壓: 4.75 V ~ 5.5 V
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 帶卷 (TR)
其它名稱: SY10EL15ZCTR
SY10EL15ZCTR-ND
5
Precision Edge
SY89321L
Micrel, Inc.
M9999-060208
hbwhelp@micrel.com or (408) 955-1690
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2006 Micrel, Incorporated.
8 LEAD ULTRA-SMALL EPAD-
MicroLeadFrame (MLF-8)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
VEE
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF Package
Package Notes:
Note 1.
Package meets Level 2 qualification.
Note 2.
All parts are dry-packaged before shipment.
Note 3.
Exposed pads must be soldered to a ground for proper thermal management.
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