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參數(shù)資料
型號(hào): SY58608UMG
廠商: Micrel Inc
文件頁(yè)數(shù): 4/10頁(yè)
文件大?。?/td> 0K
描述: IC CLOCK BUFFER 1:2 3GHZ 16-MLF
標(biāo)準(zhǔn)包裝: 100
系列: Precision Edge®
類型: 扇出緩沖器(分配)
電路數(shù): 1
比率 - 輸入:輸出: 1:2
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,LVPECL
輸出: LVDS
頻率 - 最大: 3GHz
電源電壓: 2.375 V ~ 2.635 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤,16-MLF?
供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
包裝: 管件
產(chǎn)品目錄頁(yè)面: 1083 (CN2011-ZH PDF)
其它名稱: 576-2050-5
SY58608UMG-ND
Micrel, Inc.
SY58608U
Oct. 1, 2013
3
M9999-102706-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ............................... –0.5V to +4.0V
Input Voltage (VIN) ............................ –0.5V to VCC +0.3V
LVDS Output Current (IOUT)..................................±10mA
Input Current
Source or Sink Current on (IN, /IN) ...............±50mA
Current (VREF)
Source or sink current on VREF-AC
(4) ..............±1.5mA
Maximum Operating Junction Temperature.......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VIN) ...................... +2.375V to +2.635V
Ambient Temperature (TA) ................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN
Still-air (
JA) ........................................... 60°C/W
Junction-to-board (
JB) ......................... 33°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage Range
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max. VCC
55
75
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input HIGH Voltage
(IN, /IN)
IN, /IN
1.2
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 6
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b
0.2
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
IN to VT
Voltage from Input to VT
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
JB and JA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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