Precision Edge SY89876L Micrel, Inc. M9999-082407 hbwhelp@micrel.com or (408) 955-1690 Package EP- E" />
參數(shù)資料
型號(hào): SY88773VMG
廠商: Micrel Inc
文件頁(yè)數(shù): 2/10頁(yè)
文件大?。?/td> 0K
描述: IC AMP LIMIT CML TTL LOS 16MLF
標(biāo)準(zhǔn)包裝: 100
類型: 限幅后置放大器
應(yīng)用: 光纖學(xué)網(wǎng)絡(luò)
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤,16-MLF?
供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
包裝: 管件
產(chǎn)品目錄頁(yè)面: 1089 (CN2011-ZH PDF)
其它名稱: 576-1409
10
Precision Edge
SY89876L
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
VEE
Heat Dissipation
PCB Thermal Consideration for 16-Pin MLF Package
(Always solder, or equivalent, the exposed pad to the PCB)
16-PIN MicroLeadFrame (MLF-16)
Package Notes:
Note 1.
Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form.
Note 2.
Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2005 Micrel, Incorporated.
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