Micrel, Inc.
SY89295U
March 2011
6
M9999-032511
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) ................................... –0.5V to +4.0V
Input Voltage (VIN) .......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous............................................................50mA
Surge ..................................................................100mA
Lead Temperature (soldering, 20 sec.).................... +260°C
Storage Temperature Range (TS).............–65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC)............................... +2.375V to +3.6V
Ambient Temperature (TA)..........................–40°C to +85°C
Package Thermal Resistance(3)
MLF
(θ
JA)
Still-Air ...............................................................................35°C/W
MLF
(ψ
JB)
Junction-to-Board..........................................................28°C/W
TQFP
(θJA)
Still-Air ...............................................................................28°C/W
TQFP
(ψJB)
Junction-to-Board..........................................................20°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VCC = 2.5V
2.375
2.5
2.625
VCC
Power Supply
VCC = 3.3V
3
3.3
3.6
V
IEE
Power Supply Current
No load, max. VCC
220
mA
VIN
Input Voltage Swing (IN, /IN)
See Figure 1a.
150
1200
mV
VDIFF_IN
Differential Input Voltage Swing
(IN, /IN)
See Figure 1b.
300
2400
mV
VIHCMR
Input High Common Mode Range
IN, /IN
VEE + 1.2
VCC
V
VCC = 3.3V, TA = –40°C to 85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
Input High Voltage (IN, /IN)
2.075
2.420
V
VIL
Input Low High Voltage (IN, /IN)
1.355
1.675
V
VBB
Output Voltage Reference
1.775
1.875
1.975
V
VEF
Mode Connection
1.9
2.0
2.1
V
VCF
Input Select Voltage
1.55
1.65
1.75
V
Notes:
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at
conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Rating” conditions for extended periods may
affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance on MLF
packages assumes exposed pad is soldered (or equivalent) to the device most negative potential (GND).
4. The circuit is designed to meet the DC specifications shown in the table above after thermal equilibrium has been established. Input and output
parameters vary 1:1 with VCC, with the exception of VCF.