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SLOS535B – MAY 2009 – REVISED JANUARY 2010
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
PVDD
DC supply voltage range
Relative to PGND
–0.3 to 30
V
PVDDMAX
Pulsed supply voltage range
t
≤ 100 ms exposure
–1 to 50
V
PVDDRAMP
Supply voltage ramp rate
15
V/ms
IPVDD
Externally imposed dc supply current per PVDD or PGND pin
±12
A
IPVDD_MAX
Pulsed supply current per PVDD pin (one shot)
t < 100 ms
17
A
IO
Maximum allowed dc current per output pin
±13.5
A
IO_MAX
(1)
Pulsed output current per output pin (single pulse)
t < 100 ms
±17
A
IIN_MAX
Maximum current, all digital and analog input pins(2)
DC or pulsed
±1
mA
IMUTE_MAX
Maximum current on MUTE pin
DC or pulsed
±20
mA
IIN_ODMAX
Maximum sinking current for open-drain pins
7
mA
Input voltage range for logic pin relative to SGND (SCL and
Supply voltage range:
VLOGIC
–0.3 to 7
V
SDA pins)
6.5 V < PVDD < 24 V
Supply voltage range:
VI2C_ADDR
Input voltage range for I2C_ADDR pin relative to SGND
–0.3 to 7
V
6.5 V < PVDD < 24 V
Supply voltage range:
VSTANDBY
Input voltage range for STANDBY pin
–0.3 to 5.5
V
6.5 V < PVDD < 24 V
Supply voltage range:
VOSC_SYNC
Input voltage range for OSC_SYNC pin relative to SGND
–0.3 to 3.6
V
6.5 V < PVDD < 24 V
Maximum instantaneous input voltage (per pin), analog input
Supply voltage range:
VAIN_MAX
6.5
V
pins
6.5 V < PVDD < 24 V
Maximum ac-coupled input voltage for TAS5414A(2), analog
Supply voltage range:
VAIN_AC_MAX_5414
0 to 6.5
V
input pins
6.5 V < PVDD < 24 V
Maximum ac-coupled differential input voltage for
Supply voltage range:
VAIN_AC_MAX_5424
0 to 6.5
V
TAS5424A(2), analog input pins
6.5 V < PVDD < 24 V
Supply voltage range:
VAIN_DC
Input voltage range for analog pin relative to AGND (INx pins)
–0.3 to 6.5
V
6.5 V < PVDD < 24 V
TJ
Maximum operating junction temperature range
–55 to 150
°C
Tstg
Storage temperature range
–55 to 150
°C
Power dissipation
Continuous power dissipation
Tcase = 70°C
80
W
(1)
Pulsed current ratings are maximum survivable currents externally applied to the TAS5414A and TAS5424A. High currents may be
encountered during reverse battery, fortuitous open ground, and fortuitous open supply fault conditions.
(2)
THERMAL CHARACTERISTICS
PARAMETER
VALUE (Typical)
UNIT
Junction-to-case (heat slug) thermal
RqJC
1
°C/W
resistance, DKD package
Junction-to-case (heat slug) thermal
RqJC
1.2
°C/W
resistance, PHD package
This device is not intended to be used without a heatsink. Therefore, RqJA
RqJA
Junction-to-ambient thermal resistance
°C/W
Exposed pad dimensions, DKD package
13.8 × 5.8
mm
Exposed pad dimensions, PHD package
8 × 8
mm
RECOMMENDED OPERATING CONDITIONS
(1)
MIN
TYP
MAX
UNIT
PVDDOP
DC supply voltage range relative to PGND
8
14.4
22
V
PVDDI2C
6
14.4
26.5
V
DC supply voltage range for I2C reporting
(1)
The Recommended Operating Conditions table specifies only that the device is functional in the given range. See the Electrical
Characteristics table for specified performance limits.
Copyright 2009–2010, Texas Instruments Incorporated
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