參數(shù)資料
型號： TAS5424TDKDRQ1G4
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO44
封裝： GREEN, PLASTIC, HSSOP-44
文件頁數(shù)： 32/43頁
文件大小： 978K
代理商： TAS5424TDKDRQ1G4
www.ti.com
SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
APPLICATION INFORMATION (continued)
The thermal resistance of thermal pads is generally considerably higher than a thin thermal grease layer.
Thermal tape has an even higher thermal resistance and should not be used at all. Heat sink thermal resistance
generally is predicted by the heat sink vendor, modeled using a continuous flow dynamics (CFD) model, or
measured.
Thus, for a single monaural channel in the IC, the system RθJA = RθJC + thermal grease resistance + heat sink
resistance.
The following table indicates modeled parameters for one TAS5414 or TAS5424 IC on a heat sink. The junction
temperature is set at 115
°C in both cases while delivering 20 Wrms per channel into 4- loads with no clipping.
It is assumed that the thermal grease is about 0.001 inches (0.0254 mm) thick (this is critical).
Device
TAS5414, 36-Pin PSOP3
Ambient temperature
25
°C
Power to load
20 W
× 4
Power dissipation
1.90 W
× 4
T inside package
7.6
°C
T through thermal grease
3
°C
Required heatsink thermal resistance
10.45
°C/W
Junction temperature
115
°C
System RθJA
11.85
°C/W
RθJA × power dissipation
90
°C
As an indication of the importance of keeping the thermal grease layer thin, if the thermal grease layer increases
to 0.002 inches (0.0508 mm) thick, the required heat sink thermal resistance changes to 6
°C/W for the PSOP3.
38
相關(guān)PDF資料
PDF描述
TAS5414TDKDQ1 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO36
TAS5414TDKDRQ1 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO36
TAS5414TDKDQ1G4 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO36
TAS5414TDKDRQ1G4 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO36
TAS5414TDKDMQ1 116 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO36
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