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TC1301A/B
DS21798B-page 22
2005 Microchip Technology Inc.
8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN)
Exposed Pad Length
Contact Width
Exposed Pad Width
Overall Width
Contact Length
D2
b
E2
D
L
.019
.012
.008
.063
.053
.010
.118 BSC
Number of Pins
Pitch
Standoff
Contact Thickness
Overall Length
Overall Height
p
A
A1
A3
n
Units
E
8
.000
.001
.008 REF.
.118 BSC
.031
.026 BSC
MIN
INCHES
NOM
0.48
0.26
0.30
.022
.073
.015
.063
0.20
1.60
1.34
0.55
0.37
1.85
1.59
0.02
0.80
0.00
3.00 BSC
3.00 BSC
0.20 REF.
0.65 BSC
MILLIMETERS*
NOM
8
.002
.039
MIN
MAX
0.05
1.00
MAX
n
0.90
.035
(Note 3)
(Note 3)
.059
.069
1.75
1.49
D2
E
*Controlling Parameter
Notes:
Package may have one or more exposed tie bars at ends.
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Drawing No. C04-062
Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: MO-229
A1
A
A3
Dimension Limits
TOP VIEW
EXPOSED
METAL
PAD
BOTTOM VIEW
2
1
ID INDEX
AREA
(NOTE 2)
PIN 1
D
L
E2
p
b
n
3.
TIE BAR
(NOTE 1)
EXPOSED
Revised 05/24/04