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    參數(shù)資料
    型號(hào): TC1303C-NH1EMFTR
    元件分類(lèi): 穩(wěn)壓器
    英文描述: 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
    封裝: 3 X 3 MM, 0.9 MM HEIGHT, PLASTIC, DFN-10
    文件頁(yè)數(shù): 20/38頁(yè)
    文件大小: 756K
    代理商: TC1303C-NH1EMFTR
    2008 Microchip Technology Inc.
    DS21949C-page 27
    TC1303A/TC1303B/TC1303C/TC1304
    As an example, for a 3.6V input, 1.8V output with a load
    of 400 mA, the efficiency taken from Figure 2-8 is
    approximately 84%. The internal power dissipation is
    approximately 137 mW.
    5.6.2
    LDO OUTPUT (VOUT2)
    The internal power dissipation within the TC1303/
    TC1304 LDO is a function of input voltage, output
    voltage and output current. Equation 5-7 can be used
    to calculate the internal power dissipation for the LDO.
    EQUATION 5-7:
    The maximum power dissipation capability for a
    package can be calculated given the junction-to-
    ambient thermal resistance and the maximum ambient
    temperature for the application. The following equation
    can be used to determine the package’s maximum
    internal power dissipation.
    5.6.3
    LDO POWER DISSIPATION
    EXAMPLE
    5.7
    PCB Layout Information
    Some basic design guidelines should be used when
    physically placing the TC1303/TC1304 on a Printed
    Circuit Board (PCB). The TC1303/TC1304 has two
    ground pins, identified as AGND (analog ground) and
    PGND (power ground). By separating grounds, it is
    possible to minimize the switching frequency noise on
    the LDO output. The first priority, while placing external
    components on the board, is the input capacitor (CIN1).
    Wiring should be short and wide; the input current for
    the TC1303/TC1304 can be as high as 800 mA. The
    next priority would be the buck regulator output
    capacitor (COUT1) and inductor (L1). All three of these
    components are placed near their respective pins to
    minimize trace length. The CIN1 and COUT1 capacitor
    returns are connected closely together at the PGND
    plane. The LDO optional input capacitor (CIN2) and
    LDO output capacitor COUT2 are returned to the AGND
    plane. The analog ground plane and power ground
    plane are connected at one point (shown near L1). All
    other signals (SHDN1, SHDN2, feedback in the
    adjustable-output case) should be referenced to AGND
    and have the AGND plane underneath them.
    FIGURE 5-1:
    Component Placement,
    Fixed 10-Pin MSOP.
    There will be some difference in layout for the 10-pin
    DFN package due to the thermal pad. A typical fixed-
    output DFN layout is shown below. For the DFN layout,
    the VIN1 to VIN2 connection is routed on the bottom of
    the board around the TC1303/TC1304 thermal pad.
    FIGURE 5-2:
    Component Placement,
    Fixed 10-Pin DFN.
    Input Voltage
    VIN =5V±10%
    LDO Output Voltage and Current
    VOUT =3.3V
    IOUT = 300 mA
    Internal Power Dissipation
    PLDO(MAX) =(VIN(MAX) – VOUT2(MIN)) x IOUT2(MAX)
    PLDO = (5.5V – 0.975 x 3.3V) x 300 mA
    PLDO = 684.8 mW
    P
    LDO
    V
    IN MAX
    )
    ()
    V
    OUT2 MIN
    ()
    () I
    OUT2 MAX
    )
    ()
    ×
    =
    Where:
    PLDO = LDO Pass device internal power
    dissipation
    VIN(MAX) = Maximum input voltage
    VOUT(MIN) = LDO minimum output voltage
    TC1303B
    1
    2
    6
    8
    7
    9
    10
    5
    4
    3
    +VOUT1
    PGND
    +VIN1
    AGND
    +VOUT2
    COUT1
    CIN2
    COUT2
    CIN1
    PGND Plane
    AGND Plane
    L1
    AGND to PGND
    +VIN2
    * CIN2 Optional
    -
    Via
    1
    2
    6
    8
    7
    9
    10
    5
    4
    3
    +VOUT1
    PGND
    +VIN1
    AGND
    +VOUT2
    COUT1
    CIN2
    COUT2
    CIN1
    PGND Plane
    AGND Plane
    L1
    AGND to PGND
    PGND
    * CIN2 Optional
    +VIN2
    TC1303B
    - Via
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    TC1303C-PA0EMFTR 功能描述:低壓差穩(wěn)壓器 - LDO PWM LDO combo PG RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓(最大值):307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
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