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    參數(shù)資料
    型號(hào): TC1304-NE3EMFTR
    元件分類: 穩(wěn)壓器
    英文描述: 0.5 A SWITCHING REGULATOR, 2400 kHz SWITCHING FREQ-MAX, PDSO10
    封裝: 3 X 3 MM, 0.9 MM HEIGHT, PLASTIC, DFN-10
    文件頁數(shù): 36/38頁
    文件大小: 756K
    代理商: TC1304-NE3EMFTR
    2008 Microchip Technology Inc.
    DS21949C-page 7
    TC1303A/TC1303B/TC1303C/TC1304
    1.0
    ELECTRICAL
    CHARACTERISTICS
    Absolute Maximum Ratings
    VIN - AGND.......................................................................6.0V
    All Other I/O ...............................(AGND - 0.3V) to (VIN + 0.3V)
    LX to PGND...............................................-0.3V to (VIN + 0.3V)
    PGND to AGND .................................................. -0.3V to +0.3V
    Output Short Circuit Current ................................ Continuous
    Power Dissipation (Note 7) .......................... Internally Limited
    Storage temperature .....................................-65°C to +150°C
    Ambient Temp. with Power Applied ................-40°C to +85°C
    Operating Junction Temperature...................-40°C to +125°C
    ESD protection on all pins (HBM)
    ....................................... 3kV
    Notice: Stresses above those listed under “Maximum
    Ratings” may cause permanent damage to the device. This is
    a stress rating only and functional operation of the device at
    those or any other conditions above those indicated in the
    operational listings of this specification is not implied.
    Exposure to maximum rating conditions for extended periods
    may affect device reliability.
    DC CHARACTERISTICS
    Electrical Characteristics: VIN1 =VIN2 = SHDN1,2 = 3.6V, COUT1 =CIN = 4.7 F, COUT2 =1F, L = 4.7 H, VOUT1 (ADJ) = 1.8V,
    IOUT1 = 100 mA, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
    Parameters
    Sym
    Min
    Typ
    Max
    Units
    Conditions
    Input/Output Characteristics
    Input Voltage
    VIN
    2.7
    5.5
    V
    Maximum Output Current
    IOUT1_MAX
    500
    ——
    mA
    Maximum Output Current
    IOUT2_MAX
    300
    ——
    mA
    Shutdown Current
    Combined VIN1 and VIN2 Current
    IIN_SHDN
    0.05
    1
    A
    SHDN1 =SHDN2=GND
    TC1303A,B Operating IQ
    TC1303C, TC1304 Operating IQ
    IQ
    65.0
    70.1
    110
    A
    SHDN1 =SHDN2=VIN2
    IOUT1 =0 mA, IOUT2 =0mA
    Synchronous Buck IQ
    38
    A
    SHDN1 = VIN, SHDN2 = GND
    LDO IQ
    46
    A
    SHDN1 = GND, SHDN2 = VIN2
    Shutdown/UVLO/Thermal Shutdown Characteristics
    SHDN1,SHDN2, SHDN (TC1304)
    Logic Input Voltage Low
    VIL
    ——
    15
    %VIN
    VIN1 =VIN2 = 2.7V to 5.5V
    SHDN1,SHDN2, SHDN (TC1304)
    Logic Input Voltage High
    VIH
    45
    ——
    %VIN
    VIN1 =VIN2 = 2.7V to 5.5V
    SHDN1,SHDN2, SHDN (TC1304)
    Input Leakage Current
    IIN
    -1.0
    ±0.01
    1.0
    A
    VIN1 =VIN2 = 2.7V to 5.5V
    SHDNX =GND
    SHDNY =VIN
    Thermal Shutdown
    TSHD
    165
    °C
    Thermal Shutdown Hysteresis
    TSHD-HYS
    —10
    °C
    Undervoltage Lockout
    (VOUT1 and VOUT2)
    UVLO
    2.4
    2.55
    2.7
    VVIN1 Falling
    Undervoltage Lockout Hysteresis
    UVLO
    -HYS
    200
    mV
    Note 1:
    The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2.
    2:
    VRX is the regulator output voltage setting.
    3:
    TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).
    4:
    Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
    over a load range from 0.1 mA to the maximum specified output current.
    5:
    Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
    nominal value measured at a 1V differential.
    6:
    The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
    temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
    dissipation causes the device to initiate thermal shutdown.
    7:
    The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
    these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
    able to limit the junction temperature for these cases.
    8:
    VIN1 and VIN2 are supplied by the same input source.
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