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參數(shù)資料
| 型號(hào)： | TC530CPJ |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 14/28頁 |
| 文件大小： | 0K |
| 描述： | IC DATA ACQ SUBSYSTEM 28DIP |
| 標(biāo)準(zhǔn)包裝： | 15 |
| 類型： | 數(shù)據(jù)采集系統(tǒng)（DAS） |
| 分辨率（位）： | 17 b |
| 采樣率（每秒）： | 6.5 |
| 數(shù)據(jù)接口： | 串行 |
| 電壓電源： | 單電源 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 28-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 28-DIP |
| 包裝： | 管件 |
| 其它名稱： | Q1000542A |
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2007 Microchip Technology Inc.
DS21433C-page 21
TC530/TC534
44-Lead Plastic Metric Quad Flatpack (KW) – 10x10x2 mm Body, 3.20 mm Footprint [MQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. § Significant Characteristic.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
44
Lead Pitch
e
0.80 BSC
Overall Height
A
–
2.45
Molded Package Thickness
A2
1.80
2.00
2.20
Standoff §
A1
0.00
–
0.25
Foot Length
L
0.73
0.88
1.03
Footprint
L1
1.60 REF
Foot Angle
φ
0°
–
7°
Overall Width
E
13.20 BSC
Overall Length
D
13.20 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.11
–
0.23
Lead Width
b
0.29
–
0.45
Mold Draft Angle Top
α
5°
–
16°
Mold Draft Angle Bottom
β
5°
–
16°
E
E1
D
D1
e
N
b
NOTE 1
1 2 3
NOTE 2
α
c
β
L
φ
A
A1
L1
A2
Microchip Technology Drawing C04-071B
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