參數(shù)資料
型號(hào): TDA1308TD-G
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 音頻/視頻放大
英文描述: 0.06 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8
封裝: PLASTIC, SO-8
文件頁(yè)數(shù): 11/26頁(yè)
文件大?。?/td> 197K
代理商: TDA1308TD-G
04/00
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IX. PRODUCT IDENTIFICATION
4000 CMOS PRODUCTS
Example:
H
E
F
4
X
Philips North America Package Code:
D = Plastic SO
N = Plastic Dual In-Line
DB = Shrink Small Outline (SSOP)
Philips Package Code on part:
P = Plastic Dual In-Line
T = Plastic SO
S = Shrink Small Outline (SSOP)
B = JEDEC “B” series CMOS specification
4XXX = Device number up to 5 digits
F = Limited
Family Identification
BiCMOS PRODUCTS - ABT
Example
74
ABT
XXX
X
Package Code:
A = Plastic Leaded Chip Carrier (PLCC)
D = Plastic SO
DB = Shrink Small Outline (SSOP)
N = Plastic Dual In-Line
PW = Thin Shrink Small Outline (TSSOP)
Device Number
Designates Advanced BiCMOS TTL Process
74 = Commercial Operating Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - ABT16
Example
74
ABT
16
XXX
X
Package Code:
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
Device Number
16 Bit
Designates Advanced BiCMOS TTL Process
74 = Commercial Operating Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - 3.3V LVT
Example
74
LVT
XXX
D
Package Code:
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
Device Number
3.3V Device Family
74 = Commercial Operating Temperature Range:
-40°C to +85°C
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