參數(shù)資料
型號: TDA1519CTD/N3,118
廠商: NXP SEMICONDUCTORS
元件分類: 音頻/視頻放大
英文描述: 11 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20
封裝: PLASTIC, SOT-397-1, HSOP-20
文件頁數(shù): 11/21頁
文件大?。?/td> 141K
代理商: TDA1519CTD/N3,118
2004 Jan 28
19
Philips Semiconductors
Product specication
22 W BTL or 2
× 11 W
stereo power amplier
TDA1519C
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
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