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參數(shù)資料
| 型號： | TDA1576 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | FM/IF amplifier/demodulator circuit |
| 中文描述： | FM, AUDIO DEMODULATOR, PDIP18 |
| 封裝： | 0.300 INCH, PLASTIC, SOT-102-1, DIP-18 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 128K |
| 代理商： | TDA1576 |
1998 Nov 18
14
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
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