參數(shù)資料
型號: TDA2009
廠商: 意法半導體
英文描述: 10 +10W STEREO AMPLIFIER
中文描述: 10 10W的立體聲放大器
文件頁數(shù): 9/12頁
文件大?。?/td> 191K
代理商: TDA2009
Figure 17 :
P.C. BOARD and ComponentsLayout of the Circuit of Figure 16 (1:1 scale)
APPLICATION SUGGESTION
The recommendedvalues of the components are those shown on applicationcircuit of fig. 1. Different
values can be used ; the following table can help the designer.
Component
Recommended
Value
1.2k
18k
1
Purpose
Larger than
Smaller than
R1, R3
R2, R4
R5, R6
Close Loop Gain
Setting (1)
Increase of Gain
Decrease of Gain
Dangerof Oscillation at High
Frequency with Inductive Load
High Turn-on Delay
Decrease of Gain
Increase of Gain
Frequency Stability
C1, C2
2.2
μ
F
Input DC Decoupling
High Turn-on Pop.
Higher Low Frequency
Cut-off. Increase of Noise
Degradation of SVR
C3
22
μ
F
Ripple Rejection
Better SVR. Increase of the
Switch-on Time
C6, C7
220
μ
F
Feedback Input DC
Decoupling
Frenquency Stability
Output DC
Decoupling
C8, C9
C10, C11
0.1
μ
F
1000
μ
F to
2200
μ
F
Danger of Oscillation
Higher Low-frequency
Cut-off
(1) The closed loop gain must behigher than 26dB.
The presenceof athermal limiting circuit offersthe
followingadvantages:
1) an averload on the output (even if it is
permanent), or an excessive ambient
temperaturecan be easily withstood.
2) the heatsinkcan havea smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of
excessive junction temperature : all that
happensis thatP
o
(andthereforeP
tot
) andI
o
are
reduced.
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e.
its thermalresistance); Figure 18 showsthis dissi-
pable power as a functionof ambient temperature
for different thermal resistance.
Short circuit (AC Conditions). The TDA2009Acan
withstandanaccidentalshortcircuitfromtheoutput
and ground made by a wrong connection during
normal play operation.
BUILD-IN PROTECTION SYSTEMS
THERMAL SHUT-DOWN
TDA2009A
9/12
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