參數(shù)資料
型號(hào): TDA3661T
廠商: NXP SEMICONDUCTORS
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: Very low dropout voltage/quiescent current adjustable voltage regulator
中文描述: 1.5 V-33 V ADJUSTABLE POSITIVE LDO REGULATOR, 0.3 V DROPOUT, PDSO8
封裝: 3.90 MM, PLASTIC, SOT-96, SO-8
文件頁數(shù): 13/16頁
文件大?。?/td> 88K
代理商: TDA3661T
9397 750 15049
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 — 28 June 2005
13 of 16
Philips Semiconductors
TDA3661
Very low dropout voltage/quiescent current voltage regulator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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