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參數(shù)資料
| 型號(hào)： | TDA4864AJ |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 偏轉(zhuǎn) |
| 英文描述： | Vertical deflection booster |
| 中文描述： | VERTICAL DEFLECTION IC, PZFM7 |
| 封裝： | PLASTIC, SOT-524-1, DIL-BENT-SIL, 7 PIN |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大小： | 79K |
| 代理商： | TDA4864AJ |
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2003 Oct 31
15
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4864J; TDA4864AJ
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°
C or 265
°
C, depending on solder
material applied, SnPb or Pb-free respectively.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Notes
1.
2.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
(2)
suitable
suitable
(1)
not suitable
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相關(guān)代理商/技術(shù)參數(shù) |
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| TDA4864J | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Vertical deflection booster |
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| TDA4865AJ | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. |
| TDA4865J | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. |
| TDA4866 | 制造商:Panasonic Industrial Company 功能描述:IC |
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