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參數(shù)資料
| 型號： | TDA4865AJ |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 偏轉(zhuǎn) |
| 英文描述： | eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. |
| 中文描述： | VERTICAL DEFLECTION IC, PZFM7 |
| 封裝： | PLASTIC, SOT-524-1, DIL-BENT-SIL, 7 PIN |
| 文件頁數(shù)： | 18/18頁 |
| 文件大小： | 105K |
| 代理商： | TDA4865AJ |
NXP Semiconductors
TDA4865J; TDA4865AJ
Vertical deflection booster
NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2006
Document identifier: TDA4865J_TDA4865AJ_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
8
9
10
11
12
12.1
12.2
13
14
14.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Differential input stage . . . . . . . . . . . . . . . . . . . 4
Vertical output and thermal protection . . . . . . . 4
Flyback generator. . . . . . . . . . . . . . . . . . . . . . . 4
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 8
Example for both TDA4865J and TDA4865AJ 10
Application example for different driver circuits 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering by dipping or by solder wave . . . . . 15
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
Package related soldering information . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.2
14.3
14.4
15
16
16.1
16.2
16.3
16.4
17
18
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