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| 型號(hào)： | TDA4865J |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 偏轉(zhuǎn) |
| 英文描述： | eflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. |
| 中文描述： | VERTICAL DEFLECTION IC, PZFM7 |
| 封裝： | PLASTIC, SOT-524-1, DIL-BENT-SIL, 7 PIN |
| 文件頁數(shù)： | 15/18頁 |
| 文件大?。?/td> | 105K |
| 代理商： | TDA4865J |
TDA4865J_TDA4865AJ_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2006
15 of 18
NXP Semiconductors
TDA4865J; TDA4865AJ
Vertical deflection booster
14. Soldering
14.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
14.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°
C or 265
°
C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°
C and 400
°
C, contact may be up to 5 seconds.
14.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
Table 10.
Package
Suitability of through-hole mount IC packages for dipping and wave soldering
Soldering method
Dipping
CPGA, HCPGA
-
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
PMFP
[2]
-
Wave
suitable
suitable
[1]
not suitable
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