參數(shù)資料
型號: TDA7294SV
廠商: 意法半導(dǎo)體
英文描述: 100V - 100W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY
中文描述: 100V的- 100瓦的DMOS音頻放大器靜音/意法半導(dǎo)體,由
文件頁數(shù): 8/13頁
文件大?。?/td> 339K
代理商: TDA7294SV
The TDA7294Sis a monolithicMOS power ampli-
fier which can be operated at 90V supply voltage
(100V with no signal applied) while delivering out-
put currents up to
±
6.5 A.
This allows the use of this device as a very high
power amplifier (up to 100W as peak power with
T.H.D.=10% and Rl = 4 Ohm); the onlydrawback
is the power dissipation, hardly manageable in
the above power range.
The typical junction-to-case thermal resistance of
the TDA7294S is 1
o
C/W (max=1.5
o
C/W).
To avoid that, in worst case conditions, the chip
temperature exceedes 150
o
C, the thermal resis-
tance of the heatsink must be 0.038
o
C/W (@
max ambient temperature of 50
o
C).
As the above value is pratically unreachable; a
high efficiency system is needed in those cases
where the continuous RMS output power is higher
than 50-60W.
The TDA7294S was designed to work also in
higherefficiency way.
For this reason there are four power supply pins:
two intended for the signal part and two for the
power part.
T1 and T2 are two power transistors that only
operate when the output power reaches a certain
threshold (e.g. 20 W). If the output power in-
creases, these transistors are switched on during
the portion of the signal where more output volt-
age swing is needed, thus ”bootstrapping” the
power supply pins (#13 and #15).
The current generators formed by T4, T7, zener
diodes Z1, Z2 and resistors R7,R8 define the
minimum drop across the power MOS transistors
of the TDA7294S. L1, L2, L3 and the snubbers
C9, R1 and C10, R2 stabilize the loops formed by
the ”bootstrap” circuits and the output stage of the
TDA7294S.
By considering again a maximum average
output power (music signal) of 20W, in case
of the high efficiency application, the thermal
resistance value needed from the heatsink is
2.2
o
C/W (Vs =
±
45V and Rl= 8Ohm).
All components (TDA7294S and power tran-
sistors T1 and T2) can be placed on a
1.5
o
C/W heatsink, with the power darlingtons
electrically insulated from the heatsink.
Since the total power dissipation is less than that
of a usual class AB amplifier, additional cost sav-
ings can be obtained while optimizing the power
supply, even with a highheatsink .
BRIDGE APPLICATION
Another application suggestion is the BRIDGE
configuration,where two TDA7294S are used.
In this application, the value of the load must not
be lower than 8Ohm for dissipation and current
capabilityreasons.
A suitable field of application includes HI-FI/TV
subwoofers realizations.
The main advantagesoffered by this solution are:
- High power performanceswith limited supply
voltagelevel.
- Considerablyhigh output power even with high
load values (i.e. 16 Ohm).
With Rl= 8 Ohm, Vs =
±
25V the maximum output
power obtainable is 150 W, while with Rl=16
Ohm, Vs =
±
40V the maximum Pout is 200W
(MusicPower).
APPLICATION NOTE:
(ref. fig.7)
Modular Application (more Devices in Parallel)
The use of the modular application lets very high
power be delivered to very low impedance loads.
The modular application implies one device to act
as a masterand the othersas slaves.
The slave power stages are driven by the master
device and work in parallel all together, while the
input and the gain stages of the slave device are
disabled, the figure below shows the connections
required to configure two devices to work to-
gether.
The master chip connections are the same as
the normal single ones.
The outputs can be connected together
with-
out the need of any ballastresistance.
The slave SGND pin must be tied to the nega-
tivesupply.
The slave ST-BY pin must be connected to
ST-BY pin.
The bootstrap lines must be connected to-
gether and the bootstrap capacitor must be in-
creased: for N devices the boostrap capacitor
mustbe 22
μ
F timesN.
The slave Mute and IN-pins must be grounded.
THE BOOTSTRAP CAPACITOR
For compatibility purpose with the previous de-
vices of the family, the boostrap capacitor can be
connectedboth between the bootstrappin (6) and
the output pin (14) or between the boostrap pin
(6) and the bootstraploader pin (12).
When the bootcap is connected between pin 6
and 14, the maximum supply voltage in presence
of output signal is limited to 80V, due the boot-
strap capacitorovervoltage.
When the bootcap is connected between pins 6
and 12 the maximum supply voltageextend to the
full voltage that the technologycan stand: 100V.
This is accomplished by the clamp introduced at
the bootstrap loader pin (12): this pin follows the
output voltage up to 100V and remains clamped
at 100V. This feature lets the output voltage
swing up to a gate-source voltage from the posi-
tivesupply (V
S
-3 to 6V)
TDA7294S
8/13
相關(guān)PDF資料
PDF描述
TDA7294V 100V - 100W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY
TDA7294 100V - 100W DMOS Audio Amplifier With Mute/ST-BY(帶消音和預(yù)備狀態(tài)的音頻放大器)
TDA7295 80V - 80W DMOS Audio Amplifier with Mute/ST-BY(帶消音和備用的80V-80W DMOS音頻放大器)
TDA7296S 60V - 60W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY
TDA7296SV 60V - 60W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA7294V 功能描述:音頻放大器 100W Audio Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA7294V 制造商:STMicroelectronics 功能描述:Audio Power Amplifier IC
TDA7295 功能描述:音頻放大器 80W Audio Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA7295S 功能描述:音頻放大器 80W Audio Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA7295SV 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:80V - 80W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY