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參數(shù)資料
| 型號： | TDA8542T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2 x 1 W BTL audio amplifier |
| 中文描述： | 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO16 |
| 封裝： | 7.50 MM, PLASTIC, MS-013AA, SOT-162-1, SOP-16 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 207K |
| 代理商： | TDA8542T |
1998 Mar 25
8
Philips Semiconductors
Product specification
2
×
1.5 W BTL audio amplifier
TDA8542AT
TEST AND APPLICATION INFORMATION
Test conditions
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each application
are shown separately.
The thermal resistance = 60 K/W; the maximum sine wave
power dissipation for T
amb
= 25
°
C is:
For T
amb
= 60
°
C the maximum total power dissipation is:
60
–
60
BTL application
T
amb
= 25
°
C if not specially mentioned, V
CC
= 6 V,
f = 1 kHz, R
L
= 8
, G
v
= 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application diagram is illustrated in Fig.3.
The quiescent current has been measured without any
load impedance. The total harmonic distortion as a
function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.
The figure of the mode select voltage (V
ms
) as a function
of the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depends on the supply
voltage level.
Thermal behaviour
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. Also, the thermal performance of packages
for a specific application may be different than presented
here, because the configuration of the application boards
(copper area) may be different.
Philips Semiconductors uses FR-4 type application boards
with 1 oz copper traces with solder coating.
The measurements have been carried out with vertical
placed boards.
150
25
–
60
2.1 W
=
150
1.5 W
=
Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC
(see Fig.22), the thermal resistance from junction to
ambient can be reduced to approximately 56 K/W.
For T
amb(max)
= 50
°
C the maximum total power dissipation
50
–
56
at this PCB layout is:
For the application V
CC
= 6 V and R
L
= 8
the worst case
sine wave dissipation is 1.75 W.
SE application
T
amb
= 25
°
C if not specially mentioned, V
CC
= 7.5 V,
f = 1 kHz, R
L
= 4
, G
v
= 20 dB, audio band-pass
22 Hz to 22 kHz.
The SE application diagram is illustrated in Fig.14.
If the BTL/SE pin (pin 6) is connected to ground, the
positive outputs (pins 3 and 8) will be in mute condition
with a DC level of
1
2
V
CC
. When a headphone is used
(R
L
≥
25
)
the SE headphone application can be used
without output coupling capacitors; load between negative
output and one of the positive outputs (e.g. pin 3) as
common pin.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive output
is not designed for high output current (2
×
I
o
) at low load
impedance (
≤
16
), the SE application with output
capacitors connected to ground is advised. The capacitor
value of C4/C5 in combination with the load impedance
determines the low frequency behaviour. The THD as a
function of frequency was measured using a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.
General remark
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback resistor.
To improve the immunity of HF radiation in radio circuit
applications, a small capacitor can be connected in
parallel with the feedback resistor (56 k
); this creates a
low-pass filter.
150
1.79 W
=
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| TDA8542TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 x 0.7 W BTL audio amplifier |
| TDA8542TS/N1 | 制造商:NXP Semiconductors 功能描述:AMP AUDIO PWR 1.2W AB 20SSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, PWR, 1.2W, AB, 20SSOP 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, PWR, 1.2W, AB, 20SSOP; Amplifier Class:AB; No. of Channels:2; Output Power:1.2W; Supply Voltage Range:2.2V to 18V; Amplifier Case Style:SSOP; No. of Pins:20; Load Impedance:16ohm; Operating Temperature Min:-40C; ;RoHS Compliant: Yes |
| TDA8542TS/N1,112 | 功能描述:音頻放大器 2X1.5W BTL POWER AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8542TS/N1,118 | 功能描述:音頻放大器 2X1.5W BTL PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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