參數(shù)資料
型號(hào)： TEA1532P
廠商： NXP SEMICONDUCTORS
元件分類： 穩(wěn)壓器
英文描述： GreenChip SMPS control IC
中文描述： 2 A SWITCHING CONTROLLER, 75 kHz SWITCHING FREQ-MAX, PDIP8
封裝： 0.300 INCH, PLASTIC, DIP-8
文件頁(yè)數(shù)： 22/27頁(yè)
文件大?。?/td> 147K
代理商： TEA1532P
9397 750 13113
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 May 2004
22 of 27
Philips Semiconductors
TEA1532
GreenChip
II SMPS control IC
14. Soldering
14.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it
is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing.
14.2 Through-hole mount packages
14.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
14.3 Surface mount packages
14.3.1
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all the BGA and SSOP-T packages
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TEA1532P/N1,112 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP 2 RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TEA1532PN 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP 2 RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TEA1532T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GreenChip SMPS control IC
TEA1532T/N1,118 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TEA1532T/N1-T 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 GREENCHIP RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
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